नई पीढ़ी के सिरेमिक प्लेन ग्राइंडर में अल्ट्रासोनिक कंपन ड्रेसिंग विधि का उपयोग किया जाता है

The new generation of ceramic plane grinder is a precision grinding and polishing equipment. The materials to be ground and polished are placed on a flat grinding plate. The grinding plate rotates counter clock, the correction wheel drives the workpiece to rotate, and the workpiece is pressed by gravity or other methods. The workpiece and the grinding plate make relative running friction to achieve the purpose of grinding and polishing. Because this method mainly adopts vibration, The dressing abrasive grain itself will have a certain energy, so it can get a relatively good dressing effect. It is widely used for single-sided grinding and polishing of LED sapphire substrate, optical glass wafer, quartz wafer, silicon wafer, chips, molds, light guide plates, light cutting joints and other materials.